HomeProductsCritical CoolingLiquid Cooling SolutionImmersion Cooling Module Liquid Cooled Containers

Immersion Cooling Module Liquid Cooled Containers

In row CDU: 400KW*4
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The "AlCoolit" liquid container solution from Soeteck adopts a full chain integrated delivery mode of "factory prefabricationton-sitequick connection+inteligent operation and maintenance", deeply integrating liquid cooling and auxiliary air cooling systems,intelligent power supply and distribution,inteligent monitoring, and cold aisle/hot aisle containment, This builds a full-stackinfrastructure from the "computing heart" to its "heat-dissipating blood vessels."
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  • Immersion cooling Module
  • 40 Feet
  • Immersion Liquid Cooling + In-Row CDU+UPS + External Batteries
  • Immersion Cooling Core: Adopts single-phase or two-phase immersion technology, IT equipment is fully submerged in cooling medium, with ultra-high heat dissipation efficiency.
  • Modular Container Design: Integrated into standard compact container, prefabricated in factory, easy to transport, hoist and quickly deploy on site.
  • High Reliability & Safety: Closed immersion structure, no leakage risk, equipped with medium circulation, temperature monitoring and overpressure protection systems; dust-proof, moisture-proof and anti-interference.
  • Energy-Saving & High Efficiency: Low power consumption of the whole system, supports free cooling and waste heat recovery; pPUE can reach 1.02~1.05, significantly reducing energy consumption.
  • High-Density Adaptation: Suitable for ultra-high density IT equipment, supporting cabinet power up to 100~400kW, ensuring long-term full-load operation of GPUs/CPUs.
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Product Name Immersion Cooling Module
External Dimensions 12192*3200*3800
Single cabinet power 55KW
In row CDU 400KW*4
Heat dissipation method Dry cooler or closed-circuit cooling tower
UPS Modular UPS 1000KVA host
Battery Configure according to requirements
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  • Ultra-High Density Computing: AI training/inference clusters, HPC supercomputing centers, and intelligent computing centers with high power consumption per cabinet.
  • Modular & Edge Data Centers: Containerized data centers, outdoor edge computing nodes, and remote areas requiring rapid deployment.
  • Special High-Heat Equipment: High-power electronic equipment, server clusters, and small supercomputing nodes that are difficult to cool by traditional methods.
  • Harsh Environment Deployment: Outdoor, high-temperature, high-dust scenarios, with high protection level to adapt to complex working conditions.
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